Service Lines

One flagship, a full stack behind it

Analog and Mixed-Signal is our flagship line. Physical Design, Design Verification and DFT extend it, plus a VLSI training pipeline that feeds delivery.

Flagship

Analog and Mixed-Signal Design

Physical Design

Design Verification and Modelling

Design-for-Test
Pipeline

VLSI Training

End-to-end ownership

We carry responsibility from architecture and spec through characterisation and sign-off, not just a slice of the flow.

Architect-level rigour

Every engagement runs under senior architects with direct experience from leading semiconductor industry having proven delivery pedigree.

Disciplined delivery

Industry-standard quality systems, formal issue tracking and a defined execution framework keep work predictable and on schedule.

Engagement Model

Pick the structure that fits, a single block, an embedded team, or milestone-gated delivery for higher-complexity work.
Analog and Mixed-Signal Design

High-speed interfaces, timing, data conversion and more

A full Analog and Mixed-Signal catalogue, led by High-speed interface and Timing circuits, extending through Data conversion, Power management and Full-chip integration, from kilo-sample to giga-sample requirements, in advanced process nodes and leading foundries.

Transceivers
High-Speed Interface I/O
High-speed and mixed-signal I/O spanning DDR, LPDDR, HBM, D2D/UCIe, PCIe and USB, plus general-purpose and special-purpose I/O such as CML and LVDS, along with GPIO and HSIO.
Timing Circuits
PLL, DLL and Oscillators
De-skewing and synthesized PLLs, master / slave DLLs and crystal or relaxation oscillators for high-speed links.
Data Converters
ADC and DAC
Flash, pipeline, SAR and sigma-delta ADCs, plus resistive-string and current-steering DACs.
Full-Chip Integration
Macros and Test Chips
Full-chip macros and test chips that integrate high-speed interface and analog IP, validated end to end for a range of end applications.
Power Management
References and Regulation
Bandgap references, LDOs, buck / boost converters, charge pumps, POR / BOR and ±1% temperature sensing, plus linear and switching regulators and power monitoring across the analog power stack.
Foundry
Advanced Process Nodes
GAA, FinFET, CMOS and SOI process technologies, delivered across advanced nodes and leading foundries.
Physical design

Floorplan to tapeout, sign-off ready

Physical design across the full flow, from floorplanning and place-and-route to timing closure and sign-off, delivered across advanced nodes and leading foundries.

Floorplanning and Place-and-Route
Floorplanning, power planning, cell and macro placement, clock tree synthesis and routing
Timing Closure and Signal Integrity
Static timing analysis, signal and power integrity, IR-drop closure across corners
Physical Verification and Sign-off
DRC, LVS, ESD/EM verification, parasitic extraction and GDSII sign-off
Design Verification and modelling

Proven at SoC and IP level

Analog / Mixed-Signal design verification and modelling backed by an industry-standard tool flow, covering behavioural, RF and electrical models across the signal chain.

SoC Verification
Full-chip verification across mixed-signal SoC classes: CAN transceiver, MCU, neuromorphic processor, battery management
IP Verification
Block-level low-power SoC, analog circuit, memory and RF verification
Behavioural and Electrical Modelling
Behavioural, RF, SerDes and power management modelling, backed by IBIS, CMM and RNM models, plus AFE models for ADC, DAC and PLL
Design-for-Test

Reliable, cost-efficient manufacturing test

Design-for-Test built into every design, from scan insertion and ATPG to memory and logic BIST, delivering high fault coverage at low test cost.

Scan Insertion and ATPG
Scan chain insertion and automatic test pattern generation for stuck-at and transition faults
Memory and Logic BIST
MBIST and LBIST for embedded memory and logic self-test
Boundary Scan and Coverage
JTAG boundary scan, test compression and fault coverage closure
AI-Augmented Node Migration

AI-augmented node migration and foundry porting

AI-augmented tooling drives productivity in migration and portability, a distinct service on top of our design work.

Source node / foundry

→
AI-powered

AI-augmented migration engine

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Target node / foundry

Faster turnaround

AI-assisted migration compresses schedule versus manual re-design.

Fewer re-spins

Consistent, rule-driven migration reduces design errors.

Foundry flexibility

Portable IP across Samsung, GF, UMC, SMIC, TSMC, Intel and ST.

Engagement models

Flexible models to match your scope

Pick the structure that fits, a single block, an embedded team, or milestone-gated delivery for higher-complexity work.

Project-Based

Fixed-scope delivery against defined milestones and deliverables, ideal for a single block, IP or tape-out task.

Dedicated Team

An ongoing staff-augmentation model where Gensilix engineers embed with your team on a time and materials basis.

Milestone-Based

Payment tied to agreed technical checkpoints, useful for de-risking longer or higher-complexity engagements.

Scope a pilot engagement

Tell us about your project or product need, we'll come back with a clear, scoped path.

Let's Build Together → Meet the team